X-Meritan er en professionel leverandør af ekstruderet termoelektriske materialer i Kina kvalitet. De termoelektriske materialer af kompressionstypen, som kernen i det nuværende højtydende termiske styringssystem, er blevet det foretrukne basismateriale til ultra-miniature Peltier-moduler takket være deres gennembrud i produktionsteknologien af 25-35 mm ingots med stor diameter. Gennem højtryks plastisk deformationsprocessen sikrer Kina-baserede X-Meritan, at disse højstyrkeekstruderede termoelektriske ingots besidder ekstrem høj mekanisk styrke og termisk elektrisk ensartethed, hvilket giver et pålideligt temperaturkontrolgrundlag for præcis optisk kommunikation og medicinsk udstyr.
Ekstruderede termoelektriske materialer fra X-Meritan har vist uovertrufne fordele i moderne halvlederkølingsteknologi. Især har ekstruderingsprocessen baseret på den faste Bi2Te3-Sb2Te3 løsning fuldstændig afhjulpet manglerne ved traditionelle smeltematerialer, såsom skrøbelighed og begrænset forarbejdning. Disse Bi2Te3-Sb2Te3 termoelektriske materialer til peltier-moduler besidder ikke kun termoelektriske egenskaber, der kan sammenlignes med dem ved zonesmeltemetoden, men muliggør også, på grund af sin fremragende tekstur, fremstilling af ultratynde chipmoduler med en tykkelse på kun 0,2 mm, der opfylder de strenge krav til varmetæthed, der opfylder kravene til høj effekttæthed.
Extruded Thermoelectric Materials (TEM), especially Bi2Te3-based alloys, is used to manufacture high-performance, fine-grained semiconductors with a textured and dense structure. This method can enhance mechanical strength, reduce thermal conductivity, and improve figure of merit ZT.
- Længde: 120 mm, 240 mm
- Diameter: 25 mm, 30 mm, 35 mm
- Elektrisk ledningsevne: 870-1430 Ohm-1cm-1
|
Egenskaber |
P |
N |
|
Kompressionsstyrke (MPa) |
54.0 |
66.0 |
|
Forskydningsstyrke (MPa) |
16.0 |
21.0 |
|
Young's Module (GPa) |
47.0 |
42.0 |
|
Poissons forhold |
0.30 |
0.30 |
|
Temperatur |
Langs ekstruderingsretningen |
På tværs af ekstruderingsretningen |
||
|
N |
P |
N |
P |
|
|
-25C |
10.2 |
10.6 |
12.5 |
10.8 |
|
+50C |
13.3 |
14.0 |
16.6 |
18.0 |
|
+150C |
15.5 |
15.8 |
18.3 |
19.9 |
● The Extruded Thermoelectric Materials has exceptionally high mechanical properties, enabling the production of ultra-thin chip modules with a thickness of only 0.2 millimeters.
● The solid structure is stable, with no moving parts during operation, achieving a completely silent and vibration-free working environment.
● Materialet har en høj grad af tekstur og ensartethed med et elektrisk ledningsevneområde på 870-1430 Ohm-1cm-1, hvilket sikrer ensartet ydeevne.
● The response is rapid and the temperature control is precise. Instant switching between heating and cooling can be achieved simply by changing the current direction.
● The thermoelectric performance is outstanding, with a thermoelectric figure of merit of up to 2.9x10-3 C in a 25°C vacuum environment, comparable to or even superior to that of regional melting materials.
● The integrated chip-level design has an extremely small overall size and light weight, meeting the high-density layout requirements of modern electronic devices.
● Environmentally friendly, the product manufacturing fully complies with the RoHS standard, and does not contain harmful chemicals to the environment.
● The physical reliability is extremely high. High-pressure plastic deformation eliminates internal defects, ensuring that the performance does not deteriorate under long-term cold and hot cycles.
1. Micro TEC Manufacturing: Giver substrater med høj styrke til at understøtte fremstillingen af ekstremt tynde elektriske par, der kræves i det optiske kommunikationsfelt.
2. Multi-stage TEC assembly: Utilizing extremely high consistency, it meets the requirement of highly synchronized performance of each layer of thermoelectric elements for the multi-stage stacked structure.
3. High-power industrial TEC production: With the use of large-diameter ingot specifications, the production efficiency of large-sized heat sinks is enhanced, and the unit cost is reduced.
4. Precision temperature control Peltier module: Based on precise conductivity formula, it produces special cooling components suitable for research-grade temperature control requirements.
5. Medicinsk TEC med høj pålidelighed: Understøtter fremstilling af højtydende medicinske kølechips, der kan modstå titusindvis af kolde og varme cyklusser.
1. Materials prepared by the traditional Bridgman method often have the problem of the cleavage surfaces being prone to peeling. Our Extruded Thermoelectric Materials enhance the intergranular bonding force through plastic deformation. This means that during the later slicing and thinning processes, the material can withstand extremely high mechanical stress, enabling the production of micro TEC components with a thickness of only 0.2 mm without generating micro cracks.
2. Stabiliteten af ydeevnen bragt af høj tekstur gennem stress-inducerede processer under ekstruderingsprocessen sikrer, at de elektriske og termiske egenskaber for hver batch af stænger i masseproduktion har ekstremt små afvigelser. For Permalloy-moduler, der kræver flere serieforbindelser, bestemmer materialets konsistens direkte systemets levetid og temperaturstyringsnøjagtighed.
3. The efficiency of optimizing Bi2Te3 - Sb2Te3 thermoelectric materials for Permalloy modules is highly efficient in a vacuum environment of 25 degrees Celsius. This material exhibits excellent cooling coefficient (COP). Its thermoelectric merit value (Z value) is in the first tier of global commercial materials, effectively reducing power consumption of optical modules and lasers during long-term operation.
In China, we look forward to establishing a solid cooperative relationship with you and jointly promoting the realization of technological innovation by leveraging our N-Type Extruded Thermoelectric Materials. Welcome to kontakt os and visit X-Meritan immediately and work with us to apply efficient thermoelectric conversion technology to practice and create value together.
